Multilayer ceramic capacitor and board having the same

ABSTRACT

There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor includes: three external electrodes disposed to be spaced apart from one another on a mounting surface of a ceramic body; first internal electrodes each including first and second lead portions connected to the outermost external electrodes, respectively; and second internal electrodes each including a third lead portion connected to the middle external electrode, in which a first region in which the first internal electrodes are laminated is disposed in a central portion of the ceramic body in a width direction of the ceramic body, and second regions in which the first and second internal electrodes are alternately laminated are disposed on both sides of the intervening first region in the width direction of the ceramic body.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority and benefit of Korean PatentApplication No. 10-2014-0106309 filed on Aug. 14, 2014, with the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference.

BACKGROUND

The present disclosure relates to a multilayer ceramic capacitor (MLCC)and a mounting board having the same.

As multifunctional and highly integrated large scale integration (LSI)chips consume significantly large amounts of power, 3-terminalcapacitors having excellent high frequency characteristics are commonlyused as a countermeasure to remove or attenuate noise generated in ahigh-frequency circuit, such as a power circuit of an LSI chip.

Since LSI chips consume significantly large amounts of power due tomulti-functionalized and highly integrated nature thereof, such3-terminal capacitors are required to have high allowable currents. Inorder to allow such 3-terminal capacitors to have high allowablecurrents, direct current (DC) resistance of the 3-terminal capacitorsneeds to be reduced.

That is, in order to stabilize a power circuit and effectively removenoise at a high frequency, a 3-terminal multilayer ceramic capacitorshould have low DC resistance, while satisfying the requirements of highfrequency performance.

SUMMARY

An aspect of the present disclosure may provide a multilayer ceramiccapacitor able to be used at high allowable currents by reducing directcurrent (DC) resistance, having a compact size, and having an enhancedeffect of removing noise at high frequencies, and a board having thesame.

According to an aspect of the present disclosure, there are provided amultilayer ceramic capacitor (MLCC) and a board having the same. Themultilayer ceramic capacitor includes: three external electrodesdisposed to be spaced apart from one another on amounting surface of aceramic body; first internal electrodes each including first and secondlead portions connected to the outermost external electrodes,respectively; and second internal electrodes each including a third leadportion connected to the middle external electrode, in which a firstregion in which the first internal electrodes are laminated is disposedin a central portion of the ceramic body in a width direction of theceramic body, and second regions in which the first and second internalelectrodes are alternately laminated are disposed on both sides of theintervening first region in the width direction of the ceramic body.

According to another aspect of the present disclosure, there areprovided a multilayer ceramic capacitor and a board having the same. Themultilayer ceramic capacitor includes: external electrodes disposed onboth side surfaces of the ceramic body in a length direction of theceramic body and a mounting surface of the ceramic body; first internalelectrodes disposed to be connected to the outermost externalelectrodes; and second internal electrodes having lead portionsconnected to the middle external electrode disposed on the mountingsurface of the ceramic body, in which a first region in which the firstinternal electrodes are laminated is disposed in a central portion ofthe ceramic body in a width direction of the ceramic body, and secondregions in which the first and second internal electrodes arealternately laminated are disposed on both sides of the interveningfirst region in the width direction of the ceramic body.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a multilayerceramic capacitor (MLCC) according to an exemplary embodiment in thepresent disclosure;

FIG. 2 is a perspective view illustrating a reversed ceramic body of theMLCC of FIG. 1;

FIG. 3 is an exploded perspective view illustrating the MLCC of FIG. 1without external electrodes;

FIG. 4 is a perspective view schematically illustrating an MLCCaccording to another exemplary embodiment in the present disclosure;

FIG. 5 is an exploded perspective view illustrating the MLCC of FIG. 4without external electrodes;

FIG. 6 is a perspective view schematically illustrating an MLCCaccording to another exemplary embodiment in the present disclosure;

FIG. 7 is a perspective view illustrating a ceramic body of the MLCC ofFIG. 6;

FIG. 8 is an exploded perspective view illustrating the MLCC of FIG. 6without external electrodes;

FIG. 9 is a perspective view schematically illustrating an MLCCaccording to another exemplary embodiment in the present disclosure;

FIG. 10 is an exploded perspective view illustrating an internalelectrode structure in the MLCC of FIG. 9;

FIG. 11 is an exploded perspective view illustrating another example ofan internal electrode structure in the MLCC of FIG. 9;

FIG. 12 is a perspective view illustrating a board in which the MLCC ofFIG. 1 is mounted on a circuit board;

FIG. 13 is a perspective view illustrating a board in which the MLCC ofFIG. 4 is mounted on a circuit board;

FIG. 14 is a perspective view illustrating a board in which the MLCC ofFIG. 6 is mounted on a circuit board; and

FIG. 15 is a perspective view illustrating a board in which the MLCC ofFIG. 9 is mounted on a circuit board.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure will now be described indetail with reference to the accompanying drawings.

The disclosure may, however, be exemplified in many different forms andshould not be construed as being limited to the specific embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the disclosure to those skilled in the art.

In the drawings, the shapes and dimensions of elements may beexaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

In order to clarify the exemplary embodiments, L, W, and T, definingdirections of a hexahedron (six-sided object) shown in FIG. 1 indicate alength direction, a width direction, and a thickness direction,respectively. Here, the width direction may be used as having the sameconcept as that of a lamination direction in which dielectric layers arelaminated.

Multilayer Ceramic Capacitor (MLCC)

FIG. 1 is a perspective view schematically illustrating a multilayerceramic capacitor (MLCC) according to an exemplary embodiment in thepresent disclosure, FIG. 2 is a perspective view illustrating a reversedceramic body of the MLCC of FIG. 1, and FIG. 3 is an explodedperspective view illustrating the MLCC of FIG. 1 without externalelectrodes.

Referring to FIGS. 1 through 3, an MLCC 100 according to the presentexemplary embodiment may include a ceramic body 110 in which a pluralityof dielectric layers 111 are laminated in the width direction, first andsecond internal electrodes 121 and 122, and first to third externalelectrodes 133, 134, and 136.

That is, the MLCC 100 according to the present exemplary embodiment maybe considered as a so-called 3-terminal capacitor having a total ofthree external terminals.

The ceramic body 110 may be formed by stacking a plurality of dielectriclayers 111 in the width direction and subsequently sintering the same.

Also, the plurality of dielectric layers 111 forming the ceramic body110 may be integrated in a sintered state such that boundariestherebetween may not be readily apparent without the use of a scanningelectron microscope (SEM).

The dielectric layers 111 may contain a high-k ceramic powder, forexample, barium titanate (BaTiO₃) or strontium titanate (SrTiO₃)-basedceramic powder. However, the ceramic powder of the dielectric layers 111is not limited thereto as long as sufficient capacitance can beobtained.

Also, if necessary, a ceramic additive, an organic solvent, aplasticizer, a binder, a dispersant, and the like, may be further added,together with the ceramic powder, to the dielectric layers 111.

The ceramic additive may be a transition metal oxide or carbide, a rareearth element, magnesium (Mg), aluminum (Al), or the like, but types ofceramic additives are not limited thereto.

An average particle diameter of the ceramic powder used in the formationof the dielectric layers 111 is not particularly limited and may beadjusted to achieve the purpose of the present disclosure. For example,the average particle diameter may be adjusted to 400 nm or less.

Although the shape of the ceramic body 110 is not particularly limited,the ceramic body 110 may have a hexahedral shape as illustrated, and theshape and dimensions of the ceramic body 110 and the number of laminateddielectric layers 111 are not limited to those illustrated in thepresent exemplary embodiment.

In the present exemplary embodiment, the ceramic body 110 may have afirst main surface S1 and a second main surface S2 opposing one anotherin the thickness direction, a first side surface S3 and a second sidesurface S4 connecting the first main surface S1 and the second mainsurface S2 and opposing one another in the length direction, and a thirdside surface S5 and a fourth side surface S6 opposing one another in thewidth direction. Hereinafter, a mounting surface of the MLCC 100 will bedefined as the first main surface S1 of the ceramic body 110.

The ceramic body 110 may include cover layers 112 and 113 which aredisposed at the third and fourth side surfaces S5 and S6 of the ceramicbody 110, respectively, and form marginal portions.

The cover layers 112 and 113 may have the same material andconfiguration as those of the dielectric layers 111, except that nointernal electrode is included.

The cover layers 112 and 113 may be formed by stacking a singledielectric layer or two or more dielectric layers on second regions B(to be described below) of the ceramic body 110 in the width directionof the ceramic body, and basically serve to prevent damage to the firstand second internal electrodes 121 and 122 due to physical or chemicalstress.

The ceramic body 110 according to the present exemplary embodiment mayinclude a first region A positioned in a central portion thereof in thewidth direction of the ceramic body 110 and the second regions Bpositioned on both sides of the intervening first region A in the widthdirection of the ceramic body 110.

The first region A may be formed by repeatedly stacking a plurality offirst internal electrodes 121 with the dielectric layers 111 interposedtherebetween in the width direction of the ceramic body 110.

Direct current (DC) resistance of the capacitor is in inverse proportionto the number of internal electrodes laminated in the first region A.

Thus, an increase in the number of first internal electrodes 121 of thefirst region A may reduce DC resistance, whereby an allowable currentvalue of the capacitor may be set to be high.

Here, in order to increase the number of internal electrodes 121 of thefirst region A, the thicknesses of the dielectric layers 111 in thefirst region A may be reduced to increase electrode density.

The second region B may be formed by repeatedly alternately stacking oneor more first and second internal electrodes 121 and 122 with at leastone of the dielectric layers 111 interposed therebetween.

Here, overlapping portions of the first and second internal electrodes121 and 122 serve as capacitance layers, and contribute to the formationof capacitance.

The first and second internal electrodes 121 and 122, having opposingpolarities, are disposed within the ceramic body 110, and may beelectrically insulated from each other by the intervening dielectriclayers 111.

Materials used to form the first and second internal electrodes 121 and122 are not particularly limited and, for example, a conductive pasteformed of at least one of silver (Ag), palladium (Pd), platinum (Pt),nickel (Ni), copper (Cu), and alloys thereof may be used.

Here, as a method of printing the conductive paste, a screen printingmethod, a gravure printing method, or the like, may be used, but theprinting method is not limited thereto.

Each of the internal electrodes in the present exemplary embodiment mayinclude a body portion overlapping a neighbor internal electrode and alead portion extending from the body portion so as to be led out of theceramic body 110.

Here, although not particularly limited thereto, for example, a lengthof the lead portion may be shorter than a length of the body portion inthe length direction of the ceramic body 110.

In the present exemplary embodiment, first and second lead portions 121b and 121 b′ may be disposed to be spaced apart from one another in thelength direction of the ceramic body 110, and may extend from the firstinternal electrode 121 to be exposed to the first main surface S1 of theceramic body 110 which is a mounting surface of the ceramic body 110.Here, the first internal electrode 121 serves as a signal.

Also, a third lead portion 122 b may be disposed between the first andsecond lead portions 121 b and 121 b′ in the length direction of theceramic body 110 and spaced apart from the first and second leadportions 121 b and 121 b′, and may extend from the second internalelectrode 122 to be exposed to the first main surface S1 of the ceramicbody 110. Here, the second internal electrode 122 serves as a ground.

The first and second external electrodes 133 and 134 may have the samepolarity. The first and second external electrodes 133 and 134 may bedisposed to be spaced apart from one another on the first main surfaceS1 in the length direction of the ceramic body 110 and may be in contactwith the first and second lead portions 121 b and 121 b′ exposed to thefirst main surface S1 of the ceramic body 110 so as to be electricallyconnected thereto, respectively. The first and second externalelectrodes 133 and 134 may be utilized as signal terminals, powerterminals, and the like.

The first and second external electrodes 133 and 134 may extend from thefirst main surface S1 of the ceramic body 110 to portions of the thirdand fourth side surfaces S5 and S6 of the ceramic body 110 in the widthdirection of the ceramic body 110. Thus, adhesive strength of the firstand second external electrodes 133 and 134 with respect to the ceramicbody 110 may be enhanced.

A polarity of the third external electrode 136 may be different from thepolarity of the first and second external electrodes 133 and 134. In thepresent exemplary embodiment, the third external electrode 136 may beutilized as a ground terminal.

The third external electrode 136 may be disposed between the first andsecond external electrodes 133 and 134, and may be in contact with thethird lead portion 122 b exposed to the first main surface S1 of theceramic body 110 so as to be electrically connected thereto.

The third external electrode 136 may extend from the first main surfaceS1 of the ceramic body 110 to portions of the third and fourth sidesurfaces S5 and S6 of the ceramic body 110 in the width direction of theceramic body 110.

The capacitor in the present exemplary embodiment has a 3-terminalstructure in which three external electrodes are disposed to be adjacentto each other. Thus, since distances between the first and secondexternal electrodes 133 and 134 and the third external electrode 136 arevery small, a current loop may be reduced to decrease inductance of thecapacitor.

The first to third external electrodes 133, 134, and 136 may be formedby applying and sintering a conductive paste prepared by adding glassfrits to conductive metal powder. However, the method of forming thefirst to third external electrodes 133, 134, and 136 is not limitedthereto. Here, the conductive metal may be, for example, silver (Ag),nickel (Ni), or copper (Cu), but the conductive metal is not limitedthereto.

A plating layer (not shown) may be formed on the first to third externalelectrodes 133, 134, and 136, if necessary. The plating layer serves toincrease adhesion strength between the multilayer ceramic capacitor 100and a circuit board when the multilayer ceramic capacitor 100 is mountedon the circuit board using solders.

The plating layer may include, for example, a nickel (Ni) plating layerformed on each of the first to third external electrodes 133, 134, and136 and a tin (Sn) plating layer formed on the nickel plating layer.However, the present inventive concept is not limited thereto.

Modified Example

FIG. 4 is a perspective view schematically illustrating an MLCCaccording to another exemplary embodiment in the present disclosure, andFIG. 5 is an exploded perspective view illustrating the MLCC of FIG. 4without external electrodes.

Here, the structure of the ceramic body 110 is the same as that of theprevious exemplary embodiment, and thus, a detailed description thereofwill be omitted so as to avoid redundancy, and the first and secondinternal electrodes 121 and 122 and an insulating layer 150 having astructure different from that of the previous exemplary embodiment willbe described in detail.

Referring to FIGS. 4 and 5, in an MLCC 100′ according to the presentexemplary embodiment, an insulating layer 150 may be disposed on thesecond main surface S2 opposing the mounting surface of the ceramic body110.

The insulating layer 150 may serve to prevent penetration of moisture,or the like, through portions of first and second internal electrodeswhich are exposed externally, thereby avoiding the degradation ofreliability.

Each of first internal electrodes 121 may have fourth and fifth leadportions 121 a and 121 a′ exposed to the second main surface S2 of theceramic body 110 so as to be in contact with the insulating layer 150disposed on the second main surface S2 of the ceramic body 110.

Each of second internal electrodes 122 may have a sixth lead portion 122a disposed between the fourth and fifth lead portions 121 a and 121 a′and exposed to the second main surface S2 of the ceramic body 110 so asto be in contact with the insulating layer 150.

FIG. 6 is a perspective view schematically illustrating an MLCCaccording to another exemplary embodiment in the present disclosure,FIG. 7 is a perspective view illustrating a ceramic body of the MLCC ofFIG. 6, and FIG. 8 is an exploded perspective view illustrating the MLCCof FIG. 6 without external electrodes.

Here, the structure of the ceramic body 110 is the same as that of theprevious exemplary embodiment, and thus, a detailed description thereofwill be omitted so as to avoid redundancy, and fourth to sixth externalelectrodes 131, 132, and 135 and the first and second internalelectrodes 121 and 122 having a structure different from that of theprevious exemplary embodiment will be described in detail.

Referring to FIGS. 6 through 8, in an MLCC 100″ of the present exemplaryembodiment, the fourth to sixth external electrodes 131, 132, and 135may be disposed on the second main surface S2 of the ceramic body 110 toface the first to third external electrodes 133, 134, and 136.

Namely, the MLCC 100″ may have a vertically symmetrical structure inwhich the first to third external electrodes 133, 134, and 136, face thefourth to sixth external electrodes 131, 132, and 135, respectively,thereby eliminating directionality thereof when mounted, whereby themanufacturing process may be simplified.

Here, the fourth to sixth external electrodes 131, 132, and 135 mayextend to portions of the third and fourth side surfaces S5 and S6 ofthe ceramic body 110 in the width direction of the ceramic body 110, ifnecessary.

The fourth to sixth external electrodes 131, 132, and 135 may be formedof a conductive metal.

If necessary, a plating layer (not shown) may be formed on the fourth tosixth external electrodes 131, 132, and 135.

Each of first internal electrodes 121 may have fourth and fifth leadportions 121 a and 121 a′ exposed to the second main surface S2 of theceramic body 110 so as to be connected to the fourth and fifth externalelectrodes 131 and 132 formed on the second main surface S2 of theceramic body 110.

Each of second internal electrodes 122 may have a sixth lead portion 122a disposed between the third and fourth lead portions 121 a and 121 a′and exposed to the second main surface S2 of the ceramic body 110 so asto be connected to the sixth external electrode 135.

In a case in which the internal and external structures of the MLCC 100″are vertically symmetrical, directionality of the capacitor may beeliminated.

Thus, since any of the first and second main surfaces S1 and S2 of theMLCC 100″ may be provided as a mounting surface, there is no need toconsider a direction of the mounting surface when the MLCC 100″ ismounted on a circuit board.

FIG. 9 is a perspective view schematically illustrating an MLCCaccording to another exemplary embodiment in the present disclosure, andFIG. 10 is an exploded perspective view illustrating an internalelectrode structure of the MLCC of FIG. 9.

Here, the structure of the ceramic body 110 is the same as that of theprevious exemplary embodiment, and thus, a detailed description thereofwill be omitted so as to avoid redundancy, and first and second internalelectrodes 121′ and 122 and first to fourth terminal electrodes 1131 to1134 having a structure different from that of the previous exemplaryembodiment will be described in detail.

Referring to FIGS. 9 and 10, in an MLCC 1100 of the present exemplaryembodiment, each of first internal electrodes 121′ may be exposed to thefirst and second side surfaces S3 and S4 of the ceramic body 110 in thelength direction of the ceramic body 110. The structure of the secondinternal electrodes 122 is similar to that of the structure thereof inthe capacitor of FIG. 6.

First and second terminal electrodes 1131 and 1132 may be disposed onthe third and fourth side surfaces S3 and S4 of the ceramic body 110 soas to be connected to both exposed end portions of the first internalelectrodes 121′, respectively.

Here, the first and second terminal electrodes 1131 and 1132 may coverboth end portions of the ceramic body 110 in the length direction of theceramic body 110.

Thus, adhesive strength of the first and second terminal electrodes 1131and 1132 with respect to the ceramic body 110 may be enhanced.

Third and fourth terminal electrodes 1133 and 1134 may be disposed onthe first and second main surfaces S1 and S2 of the ceramic body 110 soas to be connected to third and sixth lead portions 122 b and 122 a ofthe second internal electrodes 122, respectively.

Here, the third and fourth terminal electrodes 1133 and 1134 may extendfrom the first and second main surfaces S1 and S2 of the ceramic body110 to portions of the first and second side surfaces S3 and S4 of theceramic body 110 in the width direction of the ceramic body 110.

FIG. 11 is an exploded perspective view illustrating another example ofan internal electrode structure in the MLCC of FIG. 9.

Referring to FIG. 11, in the present exemplary embodiment, the structureof the first internal structures in the second region B is modified.

Each of first internal electrodes in the present exemplary embodimentmay include first and second electrode patterns 123 and 124 formed to bespaced apart from one another on the basis of a central portion thereof.

Here, lead portions 123 a and 124 a may extend from both end portions ofthe first and second electrode patterns 123 and 124 so as to be exposedto the first and second main surfaces S1 and S2 of the ceramic body 110.

Board Having MLCC

FIG. 12 is a perspective view illustrating a board in which the MLCC ofFIG. 1 is mounted on a circuit board, FIG. 13 is a perspective viewillustrating a board in which the MLCC of FIG. 4 is mounted on a circuitboard, FIG. 14 is a perspective view illustrating a board in which theMLCC of FIG. 6 is mounted on a circuit board, and FIG. 15 is aperspective view illustrating a board in which the MLCC of FIG. 9 ismounted on a circuit board.

Referring to FIGS. 12 through 15, a board 200 having the MLCC 100, 100′,100″, or 1100 according to an exemplary embodiment may include a circuitboard 210 on which the MLCC 100, 100′, 100″, or 1100 is mounted, andfirst to third electrode pads 221, 222, and 223 which are formed to bespaced apart from one another on an upper surface of the circuit board210.

Here, the MLCC 100, 100′, 100″, or 1100, with the first main surface S1of the ceramic body 110 or 1110 being a mounting surface, is mounted onthe circuit board 210, and the first to third external electrodes 133,134, and 136 or the first to third terminal electrodes 1131, 1132, and1133 may be connected to the circuit board 210 by solders 230, in astate in which the first to third external electrodes 133, 134, and 136or the first to third terminal electrodes 1131, 1132, and 1133 arepositioned to be in contact with the first to third electrode pads 221,222, and 223, so as to be electrically connected thereto.

In the related art 3-terminal MLCC, since direct current (DC) flowsconcentratively through the lowermost inner electrode layer disposed toface the circuit board, heating is locally generated to lower insulationresistance, degrading reliability.

However, in the exemplary embodiment of the present inventive concept,since current evenly flows across the entire internal electrodes by thefirst and second regions A and B, the possibility of degradingreliability may be reduced.

In the MLCCs according to the exemplary embodiments, the internalelectrodes may be disposed to be perpendicular with respect to the boardand positive and negative polarity terminals may be disposed to beadjacent to one another, shortening a path of current flowing from thepositive electrode terminal to the negative electrode terminal throughthe electrode pads of the board.

Thus, compared to the related art 3-terminal MLCC in which internalelectrodes are horizontally disposed with respect to the board andpositive and negative polarity terminals are disposed to be distant fromone another, the MLCCs according to the exemplary embodiments may havereduced equivalent series inductance (ESL) and the improved highfrequency noise removal effect.

For example, in a case in which the MLCC 100 of FIG. 12 is used as a3-terminal EMI filter, the first and second external electrodes 133 and134 may be connected to an input terminal and an output terminal of asignal line, respectively, and the third external electrode 136 may beconnected to a ground terminal thereof, thus effectively removing highfrequency noise of the signal line.

In this case, in the circuit board 210, the first and second electrodepads 221 and 222 having a positive (+) polarity correspond to the inputterminal and the output terminal, respectively, and the third electrodepad 223 having a negative (−) polarity corresponds to the groundterminal.

In another example, in a case in which the MLCC 100 of FIG. 12 is usedas a decoupling capacitor, the first and second external electrodes 133and 134 may be connected to a power line and the third externalelectrode 136 may be connected to a ground line so as to effectivelystabilize a power circuit.

In this case, the first and second electrode pads 221 and 222 correspondto a power line, and the third electrode pad 223 corresponds to a groundterminal.

As set forth above, according to exemplary embodiments of the presentdisclosure, DC resistance of the MLCC may be reduced, such that anallowable current value may be set to have a high level. In addition,internal power loss is reduced, and reliability and a degradation oflifespan due to heating may be prevented. Thus, when the MLCC is used asa decoupling capacitor, an EMI filter, and the like, fluctuations involtage of a power circuit may be effectively suppressed, and highfrequency attenuation characteristics and high frequency noise removaleffect may be enhanced.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the spirit and scope ofthe invention as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic capacitor comprising: aceramic body including a plurality of dielectric layers laminated in awidth direction thereof; first internal electrodes each including firstand second lead portions which extend to be exposed to a mountingsurface of the ceramic body and are disposed to be spaced apart from oneanother in a length direction of the ceramic body; second internalelectrodes each including a third lead portion which extends to beexposed to the mounting surface of the ceramic body and is disposedbetween the first and second lead portions; first and second externalelectrodes disposed to be spaced apart from one another on the mountingsurface of the ceramic body in the length direction of the ceramic bodyand connected to the first and second lead portions, respectively; and athird external electrode disposed between the first and second externalelectrodes on the mounting surface of the ceramic body and connected tothe third lead portion, wherein the ceramic body includes a first regionpositioned in a central portion thereof in the width direction andincluding the first internal electrodes with the dielectric layersinterposed therebetween, and second regions positioned on both sides ofthe intervening first region in the width direction and including thefirst and second internal electrodes alternately disposed with thedielectric layers interposed therebetween.
 2. The multilayer ceramiccapacitor of claim 1, wherein the first and second internal electrodesare disposed to be spaced apart from both side surfaces of the ceramicbody in the length direction.
 3. The multilayer ceramic capacitor ofclaim 1, wherein the first to third external electrodes extend from themounting surface of the ceramic body to portions of both side surfacesof the ceramic body in the width direction.
 4. The multilayer ceramiccapacitor of claim 1, further comprising: fourth and fifth lead portionsextending from each of the first internal electrodes to be exposed to asurface of the ceramic body opposing the mounting surface of the ceramicbody and disposed to be spaced apart from one another in the lengthdirection of the ceramic body; a sixth lead portion extending from eachof the second internal electrodes to be exposed to the surface of theceramic body opposing the mounting surface of the ceramic body anddisposed between the fourth and fifth lead portions; and an insulatinglayer disposed on the surface of the ceramic body opposing the mountingsurface of the ceramic body.
 5. The multilayer ceramic capacitor ofclaim 1, further comprising: fourth and fifth lead portions extendingfrom each of the first internal electrodes to be exposed to the surfaceof the ceramic body opposing the mounting surface of the ceramic bodyand disposed to be spaced apart from one another in the length directionof the ceramic body; a sixth lead portion extending from each of thesecond internal electrodes to be exposed to the surface of the ceramicbody opposing the mounting surface of the ceramic body and disposedbetween the fourth and fifth lead portions; fourth and fifth externalelectrodes disposed to be spaced apart from one another in the lengthdirection of the ceramic body on the surface of the ceramic bodyopposing the mounting surface of the ceramic body and connected to thefourth and fifth lead portions, respectively; and a sixth externalelectrode disposed between the fourth and fifth external electrodes onthe surface of the ceramic body opposing the mounting surface of theceramic body and connected to the sixth lead portion.
 6. The multilayerceramic capacitor of claim 5, wherein the fourth to sixth externalelectrodes extend from the surface of the ceramic body opposing themounting surface of the ceramic body to portions of both side surfacesof the ceramic body in the width direction.
 7. A multilayer ceramiccapacitor comprising: a ceramic body including a plurality of dielectriclayers laminated in a width direction thereof; first internal electrodeseach exposed to both side surfaces of the ceramic body in a lengthdirection of the ceramic body; second internal electrodes each includinga pair of lead portions which extend to be exposed to a mounting surfaceof the ceramic body and a surface of the ceramic body opposing themounting surface, respectively, and are spaced apart from both sidesurfaces of the ceramic body in the length direction; first and secondterminal electrodes disposed on both side surfaces of the ceramic bodyin the length direction and connected to both end portions of the firstinternal electrodes, respectively; and third and fourth terminalelectrodes disposed on the mounting surface of the ceramic body and thesurface of the ceramic body opposing the mounting surface and connectedto the pair of lead portions of the second internal electrodes,respectively, wherein the ceramic body includes a first regionpositioned in a central portion thereof in the width direction andincluding the first internal electrodes with the dielectric layersinterposed therebetween, and second regions positioned on both sides ofthe intervening first region in the width direction and including thefirst and second internal electrodes alternately disposed with thedielectric layers interposed therebetween.
 8. The multilayer ceramiccapacitor of claim 7, wherein each of the first internal electrodesincludes a pair of lead portions which extend from both end portions ofthe corresponding first internal electrode to be exposed to the mountingsurface of the ceramic body and the surface of the ceramic body opposingthe mounting surface, respectively.
 9. The multilayer ceramic capacitorof claim 7, wherein each of the first internal electrodes in the secondregion includes electrode patterns which are spaced apart from eachother on the basis of a central portion of the corresponding firstinternal electrode in the length direction.
 10. The multilayer ceramiccapacitor of claim 9, wherein each of the electrode patterns includes apair of lead portions which extend from both end portions of thecorresponding electrode pattern to the mounting surface of the ceramicbody and the surface of the ceramic body opposing the mounting surface,respectively.
 11. A board having a multilayer ceramic capacitor, theboard comprising: a circuit board on which first to third electrode padsare provided; and the multilayer ceramic capacitor of claim 1, whereinthe first to third external electrodes of the multilayer ceramiccapacitor are disposed on the first to third electrode pads,respectively.
 12. A board having a multilayer ceramic capacitor, theboard comprising: a circuit board on which first to third electrode padsare provided; and the multilayer ceramic capacitor of claim 7, whereinthe first to third external electrodes are provided are disposed on thefirst to third electrode pads, respectively.